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Advanced Materials

Metal–Organic Frameworks Capable of Healing at Low Temperatures

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Abstract

Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of –56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa.

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