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High-Performance Biodegradable/Transient Electronics on Biodegradable Polymers

Authors

  • Suk-Won Hwang,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Jun-Kyul Song,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Xian Huang,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Huanyu Cheng,

    1. Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL, USA
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  • Seung-Kyun Kang,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Bong Hoon Kim,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Jae-Hwan Kim,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Sooyoun Yu,

    1. Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Yonggang Huang,

    1. Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL, USA
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  • John A. Rogers

    Corresponding author
    1. Department of Materials Sicience and Engineering Chemistry, Mechanical Science and Engineering Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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Abstract

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Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.

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