Advanced Materials

Epidermal Electronics: Materials and Optimized Designs for Human-Machine Interfaces Via Epidermal Electronics (Adv. Mater. 47/2013)

Authors

  • Jae-Woong Jeong,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • Woon-Hong Yeo,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • Aadeel Akhtar,

    1. Medical Scholars Program, Neuroscience Program University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • James J. S. Norton,

    1. Neuroscience Program University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • Young-Jin Kwack,

    1. School of Display Engineering Hoseo University, Asan, Republic of Korea
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  • Shuo Li,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • Sung-Young Jung,

    1. Department of Mechanical engineering, Pohang University of Science and Technology, Pohang, Republic of Korea
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  • Yewang Su,

    1. Center for Mechanics and Materials Tsinghua University Beijing 100084, China, Department of Civil and Environmental Engineering Department of Mechanical Engineering Center for Engineering and Health Northwestern University Evanston, Illinois, USA
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  • Woosik Lee,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • Jing Xia,

    1. Department of Engineering Mechanics Tsinghua University Beijing 100084, China Department of Civil and Environmental Engineering Department of Mechanical Engineering, Center for Engineering and Health Northwestern University, Evanston, Illinois, USA
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  • Huanyu Cheng,

    1. Department of Civil and Environmental Engineering Department of Mechanical Engineering, Center for Engineering and Health Northwestern University Evanston, Illinois, USA
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  • Yonggang Huang,

    1. Department of Civil and Environmental Engineering Department of Mechanical Engineering, Center for Engineering and Health Northwestern University Evanston, Illinois, USA
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  • Woon-Seop Choi,

    1. School of Display Engineering Hoseo University, Asan, Republic of Korea
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  • Timothy Bretl,

    1. Department of Aerospace Engineering, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
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  • John A. Rogers

    Corresponding author
    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois, USA
    • Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign Urbana, Illinois 61801 USA

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Abstract

Thin, soft, and elastic electronics, which have physical properties well matched to the epidermis, can be conformally and robustly integrated with the skin. Materials and optimized design of such devices are presented for surface electromyography (sEMG) by J. A. Rogers and co-workers on page 6839. The skin-integrated electronics shown here enable use of sEMG for advanced forms of human-machine interfaces.

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