Microcapsules: Thermally Stable Autonomic Healing in Epoxy using a Dual-Microcapsule System (Adv. Mater. 2/2014)

Authors

  • Henghua Jin,

    1. Aerospace Engineering Department, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Chris L. Mangun,

    1. CU Aerospace 301 N. Neil St. – Suite 400, Champaign, IL, USA
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  • Anthony S. Griffin,

    1. Materials Science and Engineering Department, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Jeffrey S. Moore,

    1. Chemistry Department, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Nancy R. Sottos,

    1. Materials Science and Engineering Department, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Scott R. White

    Corresponding author
    1. Aerospace Engineering Department, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    • Aerospace Engineering Department, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana IL 61801 USA

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Abstract

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Hollow poly(urea-formaldehyde) microcapsules are vacuum infiltrated with a reactive amine curing agent. They are used in dual capsule epoxy-amine healing chemistry to produce thermally stable self-healing epoxy polymers by Scott R. White and co-workers on page 282. Autonomic healing in excess of 90% is achieved in a high Tg (152–213 °C) structural polymer cured at high temperature (121–177 °C).

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