Photoembossing of Periodic Relief Structures Using Polymerization- Induced Diffusion: A Combinatorial Study (pages 2567–2571)
C. Sánchez, B.-J. de Gans, D. Kozodaev, A. Alexeev, M. J. Escuti, C. van Heesch, T. Bel, U. S. Schubert, C. W. M. Bastiaansen and D. J. Broer
Article first published online: 15 SEP 2005 | DOI: 10.1002/adma.200500777
Photoembossing is a solvent-free photolithographic technique for the production of polymeric relief microstructures (see Figure). A combinatorial methodology to explore the influence of different parameters (e.g., processing temperature, binder content, photoinitiator content) on the resultant relief structure is presented using an acrylate-based model system. Results are discussed in the framework of a diffusion-polymerization model.