Ultrasmall Integrated 3D Micro-Supercapacitors Solve Energy Storage for Miniature Devices

Authors

  • Chuizhou Meng,

    Corresponding author
    1. Center for Implantable Devices, Purdue University, West Lafayette, IN, USA
    2. Weldon Schol of Biomedical Engineering, Purdue University, West Lafayette, IN, USA
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  • Jimin Maeng,

    1. Center for Implantable Devices, Purdue University, West Lafayette, IN, USA
    2. IDEAS Microwave Laboratory and Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
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  • Simon W. M. John,

    1. The Jackson Laboratory, Howard Hughes Medical Institute, Bar Harbor, ME, USA
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  • Pedro P. Irazoqui

    1. Center for Implantable Devices, Purdue University, West Lafayette, IN, USA
    2. Weldon Schol of Biomedical Engineering, Purdue University, West Lafayette, IN, USA
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Abstract

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A novel integrated 3D micro-supercapacitor is reported. A through-via bottom electrode technique is utilized for the first time for supercapacitor fabrication, and a highly miniaturized, flexible, and all-solid-state micro-supercapacitor with 3D integration capability is achieved. Module-wise compact integration of supercapacitors and their versatile powering applications are demonstrated. This device enables high-power energy storage in small-scale electronics.

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