Excimer laser micromachining
Article first published online: 14 SEP 2004
Copyright © 1993 John Wiley & Sons Ltd.
Advanced Materials for Optics and Electronics
Volume 2, Issue 1-2, pages 87–92, February 1993
How to Cite
Ihlemann, J., Schmidt, H. and Wolff-Rottke, B. (1993), Excimer laser micromachining. Adv. Mater. Opt. Electron., 2: 87–92. doi: 10.1002/amo.860020111
- Issue published online: 14 SEP 2004
- Article first published online: 14 SEP 2004
- Manuscript Revised: 17 NOV 1992
- Manuscript Received: 15 JUN 1992
The machining of several materials such as polymers, metals and ceramics using excimer lasers (193, 248 and 308 nm) was investigated. By photoablation, micrometer resolution can be achieved for polymers if the wavelength and fluence are chosen properly. High-definition processing of metals is complicated by the occurrence of surface melting. An interaction between the ablation plume and the walls of the laser-drilled holes leads to hole widening in the case of polymers at high fluences. For small structures (<100 μm) all materials investigated show a size-dependent ablation rate. This effect has to be taken into account if a precise ablation depth is required for a pattern with structures of different sizes.