On leave from Warsaw University of Technology, 00–664 Warsaw, Poland.
Coupling monolayers for protection of microelectronic circuits
Article first published online: 14 SEP 2004
Copyright © 1995 John Wiley & Sons Ltd.
Advanced Materials for Optics and Electronics
Volume 5, Issue 4, pages 199–213, July/August 1995
How to Cite
Fabianowski, W., Jaccodine, R., Kodnani, R., Pearson, R. and Smektala, P. (1995), Coupling monolayers for protection of microelectronic circuits. Adv. Mater. Opt. Electron., 5: 199–213. doi: 10.1002/amo.860050404
- Issue published online: 14 SEP 2004
- Article first published online: 14 SEP 2004
- Manuscript Revised: 20 FEB 1995
- Manuscript Received: 18 JUL 1994
- coupling agents;
- leakage currents;
Two polymeric coatings, a silicone gel (Dow Corning 6646) and an epoxy resin (Dexter FP 4402), were glob-top coated onto representative microelectronic circuits, AT&T Triple Track Testers (TTTs), and subjected to the Pressure Cooker Test (PCT). Coupling monolayers were self- assembled on the TTTs prior to encapsulation to improve the moisture protection capabilities of the coatings. Leakage current measurements were made to evaluate the effect of applied monolayers on the moisture protection capability. The moisture protection capability was assessed in short-term and long-term leakage current measurements. MHDA (16-mercaptohexadecanoic acid) and APS (gamma-aminopropyltriethoxysilane) monolayers, in combination with silicone gel and epoxy resin respectively, exhibited very good moisture protection performance.