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Semiconductor Wires and Ribbons for High- Performance Flexible Electronics

Authors

  • Alfred J. Baca,

    1. Department of Chemistry and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Jong-Hyun Ahn Dr.,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
    2. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Swon 440-746 (Korea)
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  • Yugang Sun Dr.,

    1. Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439 (USA)
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  • Matthew A. Meitl Dr.,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Etienne Menard Dr.,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Hoon-Sik Kim,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Won Mook Choi Dr.,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Dae-Hyeong Kim,

    1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • Young Huang Prof.,

    1. Department of Civil/Environmental Engineering and Department of Mechanical Engineering, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208 (USA)
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  • John A. Rogers Prof.

    1. Department of Chemistry, Materials Science and Engineering, Mechanical Science and Engineering, Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA), Fax: (+1) 217-333-2736
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Abstract

This article reviews the properties, fabrication and assembly of inorganic semiconductor materials that can be used as active building blocks to form high-performance transistors and circuits for flexible and bendable large-area electronics. Obtaining high performance on low temperature polymeric substrates represents a technical challenge for macroelectronics. Therefore, the fabrication of high quality inorganic materials in the form of wires, ribbons, membranes, sheets, and bars formed by bottom-up and top-down approaches, and the assembly strategies used to deposit these thin films onto plastic substrates will be emphasized. Substantial progress has been made in creating inorganic semiconducting materials that are stretchable and bendable, and the description of the mechanics of these form factors will be presented, including circuits in three-dimensional layouts. Finally, future directions and promising areas of research will be described.

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