We thank Simon Mitternacht for helpful discussions regarding the peptide model and C. Dammann for peptide synthesis and purification. M.B. thanks the DFG (German Science Foundation) and the Wenner-Gren Foundation (Sweden) for research fellowships, and the German–Israeli “Umbrella” program for support. M.B., A.I., and W.J. are grateful for support by the German–Swedish DAAD–STINT Personnel Exchange Programme. This work is also partially funded by the DFG under Grant No. JA 483/24-1/2/3, the Leipzig Graduate School of Excellence “BuildMoNa”, TR 67A4, and the German–French DFH-UFA PhD College under Grant No. CDFA-02-07. Supercomputer time at the John von Neumann Institute for Computing (NIC), Forschungszentrum Jülich, is acknowledged (Grant Nos. hlz11, jiff39, and jiff43).
Microscopic Mechanism of Specific Peptide Adhesion to Semiconductor Substrates†
Article first published online: 4 NOV 2010
Copyright © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Angewandte Chemie International Edition
Volume 49, Issue 49, pages 9530–9533, December 3, 2010
How to Cite
Bachmann, M., Goede, K., Beck-Sickinger, A. G., Grundmann, M., Irbäck, A. and Janke, W. (2010), Microscopic Mechanism of Specific Peptide Adhesion to Semiconductor Substrates . Angew. Chem. Int. Ed., 49: 9530–9533. doi: 10.1002/anie.201000984
- Issue published online: 1 DEC 2010
- Article first published online: 4 NOV 2010
- Manuscript Received: 16 FEB 2010
- Wenner-Gren Foundation
- DFG. Grant Number: JA 483/24-1/2/3
- Leipzig Graduate School of Excellence “BuildMoNa”. Grant Number: TR 67A4
- German–French DFH-UFA PhD College. Grant Number: CDFA-02-07
- Forschungszentrum Jülich. Grant Numbers: hlz11, jiff39, jiff43
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