This research is supported by the Dutch Technology Foundation STW (project number 07720), which is the applied science division of NWO, and the Technology Program of the Ministry of Economic Affairs. We kindly would like to acknowledge J. W. M. Frenken for his comment on the critical nucleus size.
Structural Accelerating Effect of Chloride on Copper Electrodeposition†
Article first published online: 23 JAN 2013
Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Angewandte Chemie International Edition
Volume 52, Issue 9, pages 2454–2458, February 25, 2013
How to Cite
Yanson, Y. I. and Rost, M. J. (2013), Structural Accelerating Effect of Chloride on Copper Electrodeposition . Angew. Chem. Int. Ed., 52: 2454–2458. doi: 10.1002/anie.201207342
- Issue published online: 19 FEB 2013
- Article first published online: 23 JAN 2013
- Manuscript Revised: 19 DEC 2012
- Manuscript Received: 12 SEP 2012
- Dutch Technology Foundation STW. Grant Number: 07720
- Technology Program of the Ministry of Economic Affairs
- crystal growth;
Under the microscope: In situ, video-rate scanning-tunneling-microscopy imaging during Cu electrodeposition reveals a profound structural accelerating effect of Cl− on the deposition process (see images). This effect could be present in systems with different metals and different additives. The structural accelerating effect is important for the fundamental understanding of electrodeposition phenomena and for applications in industry.