Financial support by the Deutsche Forschungsgemeinschaft (Schm 344/34-1,2, and FOR 1376), and by an exchange agreement between the DFG and CONICET are gratefully acknowledged. E. Santos, P.Q., and W.S. thank CONICET for continued support. E. Santos acknowledges PIP-CONICET 112-2010001-00411 for support. A generous grant of computing time from the Baden-Württemberg grid is gratefully acknowledged.
Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition†
Article first published online: 20 JUN 2013
Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Angewandte Chemie International Edition
Volume 52, Issue 30, pages 7883–7885, July 22, 2013
How to Cite
Pinto, L. M. C., Spohr, E., Quaino, P., Santos, E. and Schmickler, W. (2013), Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition . Angew. Chem. Int. Ed., 52: 7883–7885. doi: 10.1002/anie.201301998
- Issue published online: 17 JUL 2013
- Article first published online: 20 JUN 2013
- Manuscript Received: 9 MAR 2013
- Deutsche Forschungsgemeinschaft. Grant Numbers: Schm 344/34-1,2, FOR 1376
- PIP-CONICET. Grant Number: 112-2010001-00411
- metal deposition;
- theoretical electrochemistry
A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction.