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Keywords:

  • electrodeposition;
  • electrodes;
  • sealing layer;
  • semiconductors;
  • TiO2 nanotubes
Thumbnail image of graphical abstract

Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.