We gratefully acknowledge the DFG, especially the Cluster of Excellence (EAM), for financial support.
Reliable Metal Deposition into TiO2 Nanotubes for Leakage-Free Interdigitated Electrode Structures and Use as a Memristive Electrode†
Article first published online: 2 OCT 2013
Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Angewandte Chemie International Edition
Volume 52, Issue 47, pages 12381–12384, November 18, 2013
How to Cite
Liu, N., Lee, K. and Schmuki, P. (2013), Reliable Metal Deposition into TiO2 Nanotubes for Leakage-Free Interdigitated Electrode Structures and Use as a Memristive Electrode. Angew. Chem. Int. Ed., 52: 12381–12384. doi: 10.1002/anie.201306334
- Issue published online: 12 NOV 2013
- Article first published online: 2 OCT 2013
- Manuscript Received: 20 JUL 2013
- sealing layer;
- TiO2 nanotubes
Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.