This work was supported by research and fellowship funding from the Australian Research Council (C.J.K.), and Post-Graduate Research Awards (Y.W.) from the Australian Government and the Australian Institute of Nuclear Science and Engineering (AINSE). Work was undertaken at the Australian Synchrotron MX-1 (M2200) and PD beamlines (M2919) and at the Advanced Photon Source 1-BM-C beamline (GUP-12462). Use of the Advanced Photon Source, an Office of Science User Facility operated for the U.S. Department of Energy (DOE) Office of Science by Argonne National Laboratory, was supported by the U.S. DOE under Contract No. DE-AC02-06CH11357. We thank Gregory J. Halder for beamline support.
Interpenetration as a Mechanism for Negative Thermal Expansion in the Metal–Organic Framework Cu3(btb)2 (MOF-14)†
Article first published online: 1 APR 2014
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Angewandte Chemie International Edition
Volume 53, Issue 20, pages 5175–5178, May 12, 2014
How to Cite
Wu, Y., Peterson, V. K., Luks, E., Darwish, T. A. and Kepert, C. J. (2014), Interpenetration as a Mechanism for Negative Thermal Expansion in the Metal–Organic Framework Cu3(btb)2 (MOF-14). Angew. Chem. Int. Ed., 53: 5175–5178. doi: 10.1002/anie.201311055
- Issue published online: 8 MAY 2014
- Article first published online: 1 APR 2014
- Manuscript Received: 20 DEC 2013
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