Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines
Article first published online: 12 DEC 2002
Copyright © 2003 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 87, Issue 8, pages 1345–1353, 22 February 2003
How to Cite
Khurana, P., Aggarwal, S., Narula, A. K. and Choudhary, V. (2003), Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines. J. Appl. Polym. Sci., 87: 1345–1353. doi: 10.1002/app.11346
- Issue published online: 12 DEC 2002
- Article first published online: 12 DEC 2002
- Manuscript Accepted: 19 MAR 2002
- Manuscript Received: 27 FEB 2001
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