Alkylbenzene-Maleic anhydride photoadducts as dianhydrides for epoxies and polyimides



Dianhydrides from ethylbenzene, cumene, and branched C5-C6 alkylbenzene-maleic anhydride photoadducts have a surprisingly high solubility in epoxy resins. Dianhydrides from benzene, toluene, and n-C10-C13 alkylbenzene adducts, which are homologs of the above, were not soluble. Epoxies cured with the ethylbenzene and cumene dianhydride adducts had higher heat distortion temperatures and flexural strengths than epoxies cured with two commerical monoanhydrides. High-melting polyimides were also obtained with these two new dianhydrides.