DSC evaluation of epoxy and polyimide-impregnated laminates (prepregs)



Differential scanning calorimetry has been applied to the study of epoxy–glass and Kerimid 601 (polyimide–glass) prepregs used in making multilayer printed wiring boards. The data generated through thermal analysis are thermodynamic and kinetic. Thermodynamic properties of B-stage prepregs obtained are endothermal and exothermal peak temperatures, glass transition temperatures, and heats of residual cure. They were obtained from thermograms made at fixed scanning rates. Kinetic information obtained from isothermal cure scans gave rates of residual cure, cure times, and energies of activations. This information gives the process engineer useful information for controlling the processing of multilayer printed wiring boards.