A study on the mechanism of the curing of LARC–TPI high temperature adhesive
Article first published online: 9 MAR 2003
Copyright © 1989 John Wiley & Sons, Inc.
Journal of Applied Polymer Science
Volume 37, Issue 12, pages 3329–3334, 20 June 1989
How to Cite
Chang, S.-Y., Huang, S. J. and Johnson, J. F. (1989), A study on the mechanism of the curing of LARC–TPI high temperature adhesive. J. Appl. Polym. Sci., 37: 3329–3334. doi: 10.1002/app.1989.070371205
- Issue published online: 9 MAR 2003
- Article first published online: 9 MAR 2003
- Manuscript Accepted: 24 MAY 1988
- Manuscript Received: 21 APR 1988
A study of the changes in a LARC–TPI adhesive during a three-stage thermal curing process has been conducted. The multistage curing conditions followed commonly used industrial curing specifications. Using thermogravimetric analysis plus gas chromatography plus mass spectrometry, the gasses involved in the curing were identified. Water analysis was performed by two separate techniques and supplementary information gathered using Fourier transform infrared spectroscopy. These analytical studies permitted determination of the degree of cure at each stage and to determine whether any degradation is taking place under curing condition.