Synthesis, characterization, and properties of photosensitive silicon-containing copolyimides
Article first published online: 10 MAR 2003
Copyright © 1990 John Wiley & Sons, Inc.
Journal of Applied Polymer Science
Volume 41, Issue 3-4, pages 877–888, 1990
How to Cite
Lee, Y.-D., Lu, C.-C. and Lee, H.-R. (1990), Synthesis, characterization, and properties of photosensitive silicon-containing copolyimides. J. Appl. Polym. Sci., 41: 877–888. doi: 10.1002/app.1990.070410331
- Issue published online: 10 MAR 2003
- Article first published online: 10 MAR 2003
- Manuscript Accepted: 9 AUG 1989
- Manuscript Received: 10 MAR 1989
Copolyimides with siloxane moieties in the main chain were synthesized by solution polycondensation of 1,3-bis(3-aminopropyl) tetramethyldisiloxane (APMS), oxydianiline (ODA) with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) in N-methyl-2-pyrrolidone (NMP). The adhesion properties between copolyimides and silicon wafer were improved significantly with incorporation of siloxane moiety into polymer chain.
Photosensitive copolyimide precursor was obtained by further reaction of silicon-containing copolyamic acid with 2-isocyanatoethyl methacrylate (IEM). The insoluble fraction of photosensitive copolyimide precursor reached 90% after 10 min of irradiation with UV light. In comparison, the thermal imidization of irradiated photosensitive copolyimide precursor was more difficult than that of silicon-containing copolyamic acid. A longer heating time or higher imidization temperature was required.