The dynamic mechanical analysis of epoxy–copper powder composites using azole compounds as coupling agents

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Abstract

The dynamic mechanical properties of cured epoxy resin have been studied in which copper powder treated or untreated with azole compounds was used as fillers. The untreated fillers do not shift the glass transition temperature of the matrix polymer of the composites, whereas the storage modulus rises with increasing content of fillers. The application of azole compounds as coupling agents, which could react with both copper and epoxy resin, extended the polymer–filler interactions. The composite filled with copper powder treated with benzotriazole shows a strong reinforcement effect and high resistance to moisture.

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