Study on cure behavior of epoxy resin–BF3–MEA system by dynamic torsional vibration method

Authors

  • He Pingsheng,

    Corresponding author
    1. Department of Materials Science and Engineering, University of Science and Technology of China, Hefei 230026, Anhui, People's Republic of China
    • Department of Materials Science and Engineering, University of Science and Technology of China, Hefei 230026, Anhui, People's Republic of China
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  • Li Chune

    1. Department of Materials Science and Engineering, University of Science and Technology of China, Hefei 230026, Anhui, People's Republic of China
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Abstract

A dynamic torsional vibration method has been developed and used to investigate the isothermal cure processes of resin system of epoxy resin–boron trifluoride monoethylamine complex[BOND]SiO2, optimizing its cure conditions and estimating the apparent dynamic parameters including gel time and rate of cure reaction and discussing the effect of filler on cure. The cure behavior of resin system has been predicted by the nonequilibrium thermodynamic theory. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method.

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