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Curing behaviors of Korean Dendropanax lacquer determined by chemical and physical measures

Authors

  • Byoung-Hoo Lee,

    1. Laboratory of Adhesion and Bio-Composites, Department of Forest Products, Seoul National University, Seoul 151-742, South Korea
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  • Hyun-Joong Kim

    Corresponding author
    1. Laboratory of Adhesion and Bio-Composites, Department of Forest Products, Seoul National University, Seoul 151-742, South Korea
    • Laboratory of Adhesion and Bio-Composites, Department of Forest Products, Seoul National University, Seoul 151-742, South Korea
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Abstract

This work was performed to investigate the curing behaviors of Korean Dendropanax lacquer and to determine its sufficient curing conditions. In FTIR and AFM analyses, the peak area of C[DOUBLE BOND]C (1644 cm−1) and the microadhesion decreased with increasing curing time, attributed to oxidative thermal polymerization (or crosslinking). The magnitude of the microadhesion between the probe and the surface related to the surface tack of the lacquer indicates how well the lacquer was cured and crosslinked. The increased contact angle exhibited increasing lacquer hydrophobicity, due to polymerization, during the curing process. Changes in double bond peak, contact angle, and microadhesion were dependent on the curing temperature. The results obtained by chemical and physical measures showed that Korean Dendropanax lacquer can be effectively (economically) cured at 100°C for 150 min and at 110°C for 120 min. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 625–630, 2004

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