Modeling the curing kinetics for a modified bismaleimide resin using isothermal DSC
Version of Record online: 25 MAR 2004
Copyright © 2004 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 92, Issue 5, pages 3338–3342, 5 June 2004
How to Cite
Guo, Z.-S., Du, S.-Y., Zhang, B.-M. and Wu, Z.-J. (2004), Modeling the curing kinetics for a modified bismaleimide resin using isothermal DSC. J. Appl. Polym. Sci., 92: 3338–3342. doi: 10.1002/app.20331
- Issue online: 25 MAR 2004
- Version of Record online: 25 MAR 2004
- Manuscript Accepted: 2 DEC 2003
- Manuscript Received: 23 APR 2003
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