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Time–temperature dependency of mode II fracture toughness for bisphenol A type epoxy resin

Authors

  • Wakako Araki,

    Corresponding author
    1. Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan
    • Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan
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  • Daisuke Asahi,

    1. Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan
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  • Tadaharu Adachi,

    1. Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan
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  • Akihiko Yamaji

    1. Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan
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Abstract

We investigated the mode II fracture toughness (KIIc) with time and temperature dependence of the bisphenol A type of epoxy resin. We performed an asymmetric four-point bending test under various conditions of temperature and displacement rate. We found that KIIc strongly depended on the displacement rate and the temperature, even at room temperature. Moreover, it was governed by the time–temperature equivalence principle in regard to the fracture time. The time–temperature dependency of KIIc was similar to that of the loss modulus (E″), and the transition of brittle to ductile fractures occurred nearly simultaneously when E″ peaked. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 51–55, 2005

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