Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

Authors

  • Mohammed Naffakh,

    1. Laboratoire des Matériaux Macromoléculaires/Ingénierie des Matériaux Polymères, Unité Mixte de Recherche, Centre de la Recherche Scientifique 5627, Institut National des Sciences Appliquées de Lyon, Bâtiment Jules Verne, 20 avenue Albert Einstein, 69621 Villeurbanne Cedex, France
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  • Michel Dumon,

    Corresponding author
    1. Laboratoire des Matériaux Macromoléculaires/Ingénierie des Matériaux Polymères, Unité Mixte de Recherche, Centre de la Recherche Scientifique 5627, Institut National des Sciences Appliquées de Lyon, Bâtiment Jules Verne, 20 avenue Albert Einstein, 69621 Villeurbanne Cedex, France
    • Laboratoire des Matériaux Macromoléculaires/Ingénierie des Matériaux Polymères, Unité Mixte de Recherche, Centre de la Recherche Scientifique 5627, Institut National des Sciences Appliquées de Lyon, Bâtiment Jules Verne, 20 avenue Albert Einstein, 69621 Villeurbanne Cedex, France
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  • Jerôme Dupuy,

    1. Laboratoire des Matériaux Macromoléculaires/Ingénierie des Matériaux Polymères, Unité Mixte de Recherche, Centre de la Recherche Scientifique 5627, Institut National des Sciences Appliquées de Lyon, Bâtiment Jules Verne, 20 avenue Albert Einstein, 69621 Villeurbanne Cedex, France
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  • Jean-François Gérard

    1. Laboratoire des Matériaux Macromoléculaires/Ingénierie des Matériaux Polymères, Unité Mixte de Recherche, Centre de la Recherche Scientifique 5627, Institut National des Sciences Appliquées de Lyon, Bâtiment Jules Verne, 20 avenue Albert Einstein, 69621 Villeurbanne Cedex, France
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Abstract

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0–15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 660–672, 2005

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