Kinetics and thermal properties of epoxy resin cured with Ni(II)-tris-(O-pheneylendiamine) bromide

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Abstract

Diglycidyl ether of bisphenol A (DGEBA) is cured with a nickel complex of O-phenylendiamine (OPD) as a ligand. The structure of the synthesized curing agent is confirmed through IR and elemental analysis. The curing kinetics of DGEBA/Ni(OPD)3Br2 system is studied by the dynamic DSC and isothermal FTIR techniques. In all cases, we have observed at least two exothermic peaks during DSC traces up to 350°C. Dynamic activation energies are calculated by using the two isoconversional, Kissinger and Ozawa, methods applied to peak maximum. A two-parameter (m, n) autocatalytic model (Sestak–Berggren equation) is found to be the most adequate model to describe the cure kinetics of the observed thermal events. Isothermal kinetic parameters are estimated using the Horie model. The onset decomposition temperature and char yield (at 700°C) of the crosslinked material were 290°C and 27%, respectively. The activation energy of the solid-state thermal degradation process is evaluated by Ozawa approach, resulting in 95–138 kJ/mol on a range of 2–20% decomposition conversion. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1257–1265, 2006

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