Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard
Article first published online: 24 MAY 2006
Copyright © 2006 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 101, Issue 3, pages 1787–1792, 5 August 2006
How to Cite
Park, B.-D., Chang Kang, E. and Yong Park, J. (2006), Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard. J. Appl. Polym. Sci., 101: 1787–1792. doi: 10.1002/app.23538
- Issue published online: 24 MAY 2006
- Article first published online: 24 MAY 2006
- Manuscript Accepted: 28 SEP 2005
- Manuscript Received: 10 MAY 2005
- Agricultural Research and Planning Center (ARPC). Grant Number: 303003–03
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