Preparation, intermolecular motion, and thermal properties of thiodiphenyl epoxy



The thiodiphenyl epoxy (THEP) was prepared by the 4,4′-thiodiphenol (THDOL) and the epichlorohydrin (ECH) without using any NaOH or KOH catalysts. The THEP possessed weak hydrogen bonding in the cured THEP/DGEBA system. The intermolecular motion parameters k and q were 0.26 and −168.5, respectively, which determined by the Gordon-Taylor and Kwei equations. The soft sulfide linkage ([BOND]S[BOND]) of the THEP degraded at lower temperature than cured DGEBA material, and further to form various thermal stable sulfate derivative chars. The char yields increased from 11.43 to 25.94 wt % and from 0.65 to 1.04 wt % in the nitrogen and air, respectively. Introduction of the THEP into the DGEBA could provide the antioxidation thermal property and improve the thermal stability of the DGEBA epoxy in the air. In the air atmosphere, the activation energies of the second thermal degradation were increased from 66.67 to 103.42 kJ/mol. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010