Preparation, intermolecular motion, and thermal properties of thiodiphenyl epoxy
Version of Record online: 11 JUN 2010
Copyright © 2010 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 118, Issue 4, pages 2116–2125, 15 November 2010
How to Cite
Chiu, Y.-C., Tsai, H.-C., Chou, I.-C., Lin, W.-N., Yang, S.-Y., Tien, H.-W. and Ma, C.-C. M. (2010), Preparation, intermolecular motion, and thermal properties of thiodiphenyl epoxy. J. Appl. Polym. Sci., 118: 2116–2125. doi: 10.1002/app.32602
- Issue online: 4 AUG 2010
- Version of Record online: 11 JUN 2010
- Manuscript Accepted: 21 MAR 2010
- Manuscript Received: 9 JUN 2009
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