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Keywords:

  • polydimethylsiloxane (PDMS) elastomers;
  • reactive ion etching (RIE);
  • storage modulus;
  • etch rate;
  • etched profiles

Abstract

Soft polydimethylsiloxane (PDMS) elastomers spin coated on silicon wafers are patterned using plasma etching. The elastomers are formed by mixing vinyl-terminated PDMS (prepolymer) and crosslinker containing hydride sites. The elastomers are made softer by adding either excess prepolymer, excess crosslinker, or swelling agent. The different elastomers were etched using reactive ion etching, an old and well established processing technology in the microelectronic and MEMS industry. The etch rate and profiles of the etched surfaces were dependent on the process pressure. The dependence was different for the different elastomers. It was found that at low pressure, the etch rate was dependent on the shear modulus. At high pressures, the etch rate was dependent on the chemical composition of the elastomer. The results for the swollen elastomers were different from those for the nonswollen elastomers. The etch rate was lower and the profiles of the etched cavities were different. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011