High-performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability, low dielectric constant and loss

Authors

  • Pingzhen Huang,

    1. Department of Materials Science & Engineering, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, Jiangsu 215123, People's Republic of China
    Search for more papers by this author
  • Aijuan Gu,

    Corresponding author
    1. Department of Materials Science & Engineering, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, Jiangsu 215123, People's Republic of China
    • Department of Materials Science & Engineering, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, Jiangsu 215123, People's Republic of China
    Search for more papers by this author
  • Guozheng Liang,

    1. Department of Materials Science & Engineering, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, Jiangsu 215123, People's Republic of China
    Search for more papers by this author
  • Li Yuan

    1. Department of Materials Science & Engineering, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, Jiangsu 215123, People's Republic of China
    Search for more papers by this author

Abstract

High-performance hyperbranched poly(phenylene oxide)-modified bismaleimide resin with high thermal stability, low dielectric constant, and loss was developed, which is made up of hyperbranched poly(phenylene oxide) (HBPPO), 4,4′-bismaleimidodiphenylmethane (BDM), and o, o′-diallylbisphenol A (DBA). The curing reactivity, morphology, and performance of BDM/DBA/HBPPO resin were systemically investigated, and similar investigations for BDM/DBA resin were also carried out for comparison. Results show that BDM/DBA/HBPPO and BDM/DBA resins have similar curing mechanism, but the former can be cured at lower temperature than the later; in addition, cured BDM/DBA/HBPPO resin with suitable HBPPO content has better thermal stability and dielectric properties (lower dielectric constant and loss) than BDM/DBA resin. The difference in macroproperties between BDM/DBA/HBPPO and BDM/DBA resins results from the different chemical structures and morphologies of their crosslinking networks. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011

Ancillary