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Cure and thermal stability of poly(amide-amidic acid)—cured tetraglycidyl 4,4′-diaminodiphenylmethane

Authors

  • Haiming Chen,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Renguo Lu,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Pei Li,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Hongyan Wang,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Ting Huang,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Zhongyuan Huang,

    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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  • Tongsheng Li

    Corresponding author
    1. Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
    • Key Laboratory of Molecular Engineering of Polymers of Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China
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Abstract

A novel curing agent, poly (amide-amidic acid) (PAA), was used to cure tetraglycidyl 4,4′-diaminodiphenylmethane (TGDDM). The initial cure and exothermic peak temperatures increased with increase in PAA content. The mechanism for the cure of TGDDM/PAA was proposed which involved, besides TGDDM cure, PAA imidization in the system. Examination of the morphology of the fractured surface using scanning electron microscopy showed that curing with PAA improved more the fracture toughness as compared to the conventional 4,4′-diaminodiphenylsulfone (DDS), and rendered TGDDM more fire resistant with higher char yield. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

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