Enhancement of adhesion between copper foil and polyimide film containing thermally decomposable polystyrene particles
Article first published online: 25 APR 2012
Copyright © 2012 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Special Issue: Polymer Research in Asia-Pacific
Volume 126, Issue S2, pages E365–E370, 25 November 2012
How to Cite
Tsai, M.-H., Huang, Y.-C., Tseng, I.-H., Yu, H.-P. and Lin, Y.-K. (2012), Enhancement of adhesion between copper foil and polyimide film containing thermally decomposable polystyrene particles. J. Appl. Polym. Sci., 126: E365–E370. doi: 10.1002/app.36615
- Issue published online: 2 AUG 2012
- Article first published online: 25 APR 2012
- Manuscript Accepted: 30 NOV 2011
- Manuscript Received: 5 OCT 2011
- Ministry of Economic Affairs, Taiwan
- ROC (through the project on flexible polymeric materials for electronic application [99-EC-17-A-07-S1-120]) and National Science Council, Taiwan
- ROC (through the project [99-2815-C-167-019-E])
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