Photopolymerization kinetics and thermal properties of dimethacrylate based on bisphenol-S

Authors

  • Chunguang Li,

    1. State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
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  • Jue Cheng,

    1. State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
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  • Yu Jian,

    1. State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
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  • Wenkai Chang,

    1. State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
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  • Jun Nie

    Corresponding author
    1. State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
    • State Key Laboratory of Chemical Resource Engineering, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, People's Republic of China
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Abstract

A dimethacrylate based on bisphenol-S (DBSMA) was prepared and characterized by Fourier Transform infrared spectroscopy (FTIR), Electrospray Ionisation Tandem Mass Spectrometry (ESI/MS) 1H NMR, and 13C NMR. DBSMA was investigated by a real-time infrared spectroscopy (RTIR), under different conditions such as varying photoinitiator type and concentration, with and without oxygen, mixing with different amounts of a reactive diluent [1,6-hexanediol dimethacrylate (HDDMA)]. The mechanical and thermal properties of these curing films were also investigated by dynamic mechanical analysis and thermogravimetric analysis. The results showed homopolymer of DBSMA has better thermal stability than copolymers of DBSMA/HDDMA systems. Also, the cured DBSMA polymer exhibited higher glass transition temperature (Tg) and better thermal stability compared with commercial available resin 2,2-Bis[4-(2-hydroxy-3-methacryloxypropoxy)phenyl]propane (BIS-GMA) (CN151). © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013

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