The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation
Article first published online: 6 JUN 2012
Copyright © 2012 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 127, Issue 6, pages 4456–4462, 15 March 2013
How to Cite
Zhang, X., Du, L. and Xu, Z. (2013), The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation. J. Appl. Polym. Sci., 127: 4456–4462. doi: 10.1002/app.38011
- Issue published online: 20 DEC 2012
- Article first published online: 6 JUN 2012
- Manuscript Accepted: 5 MAY 2012
- Manuscript Received: 21 FEB 2012
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