The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation
Article first published online: 6 JUN 2012
Copyright © 2012 Wiley Periodicals, Inc.
Journal of Applied Polymer Science
Volume 127, Issue 6, pages 4456–4462, 15 March 2013
How to Cite
Zhang, X., Du, L. and Xu, Z. (2013), The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation. J. Appl. Polym. Sci., 127: 4456–4462. doi: 10.1002/app.38011
- Issue published online: 20 DEC 2012
- Article first published online: 6 JUN 2012
- Manuscript Accepted: 5 MAY 2012
- Manuscript Received: 21 FEB 2012
Options for accessing this content:
- Login via other institutional login options http://onlinelibrary.wiley.com/login-options.
- You can purchase online access to this Article for a 24-hour period (price varies by title)
- New Users: Please register, then proceed to purchase the article.
Registered Users please login:
- Access your saved publications, articles and searches
- Manage your email alerts, orders and subscriptions
- Change your contact information, including your password
Please register to:
- Save publications, articles and searches
- Get email alerts
- Get all the benefits mentioned below!