Inside Cover, Volume 127, Issue 4


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The TEM image shows that meso-pores with sizes of about 50 nm are formed in a photosensitive material to reduce its dielectric constant. The t-BOC photosensitive system is patternable and the mesoporosity is generated through the combination of photoexposure and thermal treatment. The results by Song-Shiang Lin, Yu-Jen Chan, and Yu-Der Lee on page 3269, show that more mesopores have been formed at higher t-BOC content, which leads to a lower dielectric constant. The pore size and porosity also increase with the hard-baking temperature, and have resulted in the decrease of dielectric constant.