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A new method to estimate thermal conductivity of polymer composite using characteristics of fillers

Authors

  • Hui Joon Park,

    1. Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
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    • Hui Joon Park and Tae Ann Kim contributed equally to the work.

  • Tae Ann Kim,

    1. Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
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    • Hui Joon Park and Tae Ann Kim contributed equally to the work.

  • Raehyun Kim,

    1. Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
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  • Junkyung Kim,

    1. Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
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  • Min Park

    Corresponding author
    1. Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
    • Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seoungbuk-gu, Seoul 136-791, Korea
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Abstract

In this work, a new method to estimate the thermal conductivity of polymer composite was suggested. For this purpose, polymer composites composed of high-density polyethylene (HDPE) and boron nitride (BN) were prepared by twin-screw extruder melt-mixing, followed by compression molding technique, and their microstructure was investigated by material simulation. Consequently, the Cf parameter of Agari and Uno equation, which represents an ease in forming conductive chains, was quantified by “Structure factor (related with conductive pathway)” and “Interfacial factors (related with thermal resistance)”, ultimately helping us evaluate the thermal conductivity of arbitrary composite system. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013

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