• microencapsulation;
  • solvent evaporation method;
  • curing agent;
  • imidazole;
  • epoxy resin


The epoxy–imidazole resin system is used to form the anisotropic conducting film. The latent character of the system is very significant. In this study, imidazole (Im) or 2-methylimidazole (2MI) was encapsulated for the latent curing system to use in the reaction of epoxy resin. Polycaprolactone was used as a wall material, and the solvent evaporation method was used to form the microcapsule using W/O/W emulsion. The shelf life of the microcapsules was studied for the epoxy resin, and the curing behavior of the microcapsules for epoxy resin was examined using a differential scanning calorimeter. The curing times at 150 and 180°C were estimated using an indentation method. The microcapsules of Im or 2MI exhibited a long shelf life for epoxy resin. When comparing the results of the previous methods with the results of this study using the W/O/W emulsion, finer microcapsules were formed and the microcapsule has longer shelf life. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013