Preparation of heat-moisture resistant epoxy resin based on phosphazene

Authors

  • Xiaobin Huang,

    Corresponding author
    1. School of Chemistry and Chemical Engineering, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
    • School of Chemistry and Chemical Engineering, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
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  • Wei Wei,

    1. School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
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  • Hao Wei,

    1. Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
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  • Yonghua Li,

    1. King Fa Sci. & Tech. Co., Ltd., Guangzhou 510520, People's Republic of China
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  • Xiaojun Gu,

    1. School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
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  • Xiaozhen Tang

    1. School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
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Abstract

An amine-terminated curing agent for epoxy resin based on hexachlorocyclotriphosphazene was synthesized. Its chemical structure was characterized by1H-NMR, FT-IR, and elemental analysis. The curing temperature was determined by differential scanning calorimeter. The thermal stability, hydrophobicity, flame retardancy, and insulation property of the epoxy resin cured by the as-prepared curing agent were superior to those of the epoxy resin cured by 4,4′-diaminodiphenylsulfone. The epoxy resin cured by the new curing agent obtained the best heat-moisture resistance when the ratio of amino protons and epoxy group was 1.2 : 1. The temperature reached 318 and 376°C when the weight loss was 5 and 10% meanwhile the residue at 800°C was above 64%. The material achieved UL94 V-0 rating and the water absorption was only 0.57%. The electric insulation property was also improved especially when it was compared in wet conditions at water absorption saturation. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013

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