Recent progress in interfacial toughening and damage self-healing of polymer composites based on electrospun and solution-blown nanofibers: An overview

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Errata

This article is corrected by:

  1. Errata: Recent progress in interfacial toughening and damage self-healing of polymer composites based on electrospun and solution-blown nanofibers: An overview Volume 130, Issue 6, 4614, Article first published online: 5 September 2013

  • Corrections added on 28 August 2013, after first online publication.

Correspondence to: A. L. Yarin (E-mail: ayarin@uic.edu) or X.-F. Wu (E-mail: xiangfa.wu@ndsu.edu)

ABSTRACT

In this article, we provide an overview of recent progress in toughening and damage self-healing of polymer–matrix composites (PMCs) reinforced with electrospun or solution-blown nanofibers at interfaces with an emphasis on the innovative processing techniques and toughening and damage self-healing characterization. Because of their in-plane fiber architecture and layered structure, high-performance laminated PMCs typically carry low interfacial strengths and interlaminar fracture toughnesses in contrast to their very high in-plane mechanical properties. Delamination is commonly observed in these composite structures. Continuous polymer and polymer-derived carbon nanofibers produced by electrospinning, solution blowing, and other recently developed techniques can be incorporated into the ultrathin resin-rich interlayers (with thicknesses of a few to dozens of micrometers) of these high-performance PMCs to form nanofiber-reinforced interlayers with enhanced interlaminar fracture toughnesses. When incorporated with core–shell healing-agent-loaded nanofibers, these nanofiber-richened interlayers can yield unique interfacial damage self-healing. Recent experimental investigations in these topics are reviewed and compared, and recently developed techniques for the scalable, continuous fabrication of advanced nanofibers for interfacial toughening and damage self-healing of PMCs are discussed. Developments in the near future in this field are foreseen. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2225–2237, 2013

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