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Cationic photopolymerization of bisphenol A diglycidyl ether epoxy under 385 nm

Authors

  • Guodong Liu,

    1. State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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  • Xiaoqun Zhu,

    1. State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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  • Bingbing Xu,

    1. State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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  • Xiaochun Qian,

    1. State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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  • Guoqiang Song,

    1. State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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  • Jun Nie

    Corresponding author
    • State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing, People's Republic of China
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Correspondence to: J. Nie (E-mail: niejun@mail.buct.edu.cn)

ABSTRACT

The cationic photopolymerization of bisphenol A diglycidyl ether epoxy (DGEBA) at λ = 385 nm was conducted by the combination of a cationic photoinitiator PAG30201 (Bis (4-isobutylphenyl) iodonium hexafluorophosphate) and a photosensitizer PSS303 (9,10-dibutoxy-9,10-dihydroanthrance). The kinetic characterization was investigated by real-time Fourier transform infrared spectroscopy. The enhancement of epoxy conversion of DGEBA was achieved by increasing temperature, adding alcohols, active monomers and radical photoinitiators. As a result, in the presence of 2 wt % PAG30201 and 1.2 wt % PSS303, the epoxy rings conversion of DGEBA has reached to more than 70% from 55.9% at room temperature; it could be increased to almost 80% if heated to 60°C. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 3698–3703, 2013

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