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Keywords:

  • copper;
  • electrodeposition;
  • ionic liquids;
  • liquid metal salts;
  • N ligands

Abstract

New metal-containing ionic liquids [Cu(CH3CN)n][Tf2N] (n=2, 4; Tf2N=bis(trifluoromethylsulfonyl)- amide) have been synthesised and used as a non-aqueous electrolyte for the electrodeposition of copper at current densities greater than 25 A dm−2. The tetrahedral copper(I)-containing cation in [Cu(CH3CN)4][Tf2N] is structurally analogous to quaternary ammonium and phosphonium ionic liquids and overcomes problems of metal solubility and mass transport. Two CH3CN ligands are removed at elevated temperatures to give [Cu(CH3CN)2][Tf2N], which can be used as a concentrated non-aqueous electrolyte. The structural and electrochemical characterisation of these compounds is described herein.