Simulation of Chemical Vapor Infiltration and Deposition Based on 3D Images: A Local Scale Approach

Authors

  • William Ros,

    1. Lab. des Composites Thermostructuraux UMR 5801 CNRS-SNECMA-CEA-UB1, 3 allée de la Boëtie 33600 Pessac (France)
    2. Lab. Intégration Matériau au Système UMR 5218 CNRS-UB1, 351 Cours de la Libération 33405 Talence (France)
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  • Gérard L. Vignoles,

    Corresponding author
    1. Lab. des Composites Thermostructuraux UMR 5801 CNRS-SNECMA-CEA-UB1, 3 allée de la Boëtie 33600 Pessac (France)
    • Lab. des Composites Thermostructuraux UMR 5801 CNRS-SNECMA-CEA-UB1, 3 allée de la Boëtie 33600 Pessac (France).
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  • Christian Germain,

    1. Lab. Intégration Matériau au Système UMR 5218 CNRS-UB1, 351 Cours de la Libération 33405 Talence (France)
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  • Philippe Supiot,

    1. Institut d'Electronique, de Microéletronique et de Nanotechnologie UMR 8520, BioMEMS Group, Université de Lille, F59655 Villeneuve d'Ascq (France)
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  • George Kokkoris

    1. Institute of Microelectronics, National Center for Scientific Research “Demokritos”, Aghia Paraskevi 15310 (Greece)
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  • The authors wish to thank the French Ministry for Education & Research as well as SAFRAN- Snecma Propulsion Solide for PhD funding to W. Ros. They are also indebted to the CNRS research group GdR 3184 “SurGeCo” for initiating the collaboration between all partners.

Abstract

A numerical solution for the simulation of chemical vapor infiltration (CVI) of ceramic matrix composites is presented. This computational model requires a 3D representation of the preform. Gas transport and chemical reaction are simulated by a Monte Carlo random walk technique. The developed algorithm can also be used for the determination of effective transport and reaction properties in a porous medium. It is firstly validated by considering the simple case of diffusion and reaction in a flat pore. Results of infiltration of an actual fiber arrangement are described and discussed. Extension to deposition on a thin substrate with asperities is also studied

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