Automatic teg measuring and data processing system

Abstract

With the increase in integration and density of LSI, it has become necessary to control design and fabrication more precisely than before. In particular, for the precise control of the wafer process, a thorough analysis of element characteristics using test elements group (TEG) is essential. This paper describes a TEG measuring system which is capable of evaluating LSI composed of many elements. This system performs automatic measurements and data processing of wafers utilizing a minicomputer. Since the inputs required for the automatic measurement and data processing are performed in a conversational mode, it is possible to determine the next measuring condition of data processing method while the measured result is being analyzed. By these means, data collection and data processing of various TEGs at the development stage of the LSI can be carried out at a sufficiently satisfactory level. Moreover, by paying careful attention to the man-machine interface it is possible for those people who are not used to a computer to perform the measurement and data processing easily. By realization of this system the various quantities and different kinds of measuring data required during the LSI development can easily be analyzed within 3 to 30 minutes. This results in a change of the development method of the LSI itself and enables us to perform precise control of the wafer process efficiently.