Microfluidics and Miniaturization
Packaging of microfluidic chips via interstitial bonding technique
Version of Record online: 3 MAR 2008
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 29, Issue 7, pages 1407–1414, No. 7 April 2008
How to Cite
Lu, C., Lee, L. J. and Juang, Y.-J. (2008), Packaging of microfluidic chips via interstitial bonding technique. ELECTROPHORESIS, 29: 1407–1414. doi: 10.1002/elps.200700680
- Issue online: 2 APR 2008
- Version of Record online: 3 MAR 2008
- Manuscript Received: 30 MAY 2007
- Ohio Department of Development. Grant Number: 747434
- National Science Foundation
- National Science Council in Taiwan. Grant Number: 95-2221-E-006-405
- The authors have declared no conflict of interest.
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