Data mining for improving the solder bumping process in the semiconductor packaging industry
Version of Record online: 9 JAN 2007
Copyright © 2007 John Wiley & Sons, Ltd.
Intelligent Systems in Accounting, Finance and Management
Special Issue: Intelligent Systems in Operations Management
Volume 14, Issue 1-2, pages 43–57, January - June 2006
How to Cite
Chien, C.-f., Li, H.-c. and Jeang, A. (2006), Data mining for improving the solder bumping process in the semiconductor packaging industry. Int. J. Intell. Syst. Acc. Fin. Mgmt., 14: 43–57. doi: 10.1002/isaf.273
- Issue online: 9 JAN 2007
- Version of Record online: 9 JAN 2007
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