Fast 3D thermal simulation of power module packaging
Version of Record online: 18 JAN 2012
Copyright © 2012 John Wiley & Sons, Ltd.
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
Volume 25, Issue 4, pages 378–399, July/August 2012
How to Cite
Swan, I. R., Bryant, A. T. and Mawby, P. A. (2012), Fast 3D thermal simulation of power module packaging. Int. J. Numer. Model., 25: 378–399. doi: 10.1002/jnm.841
- Issue online: 18 JUN 2012
- Version of Record online: 18 JAN 2012
- Manuscript Accepted: 17 OCT 2011
- Manuscript Revised: 9 AUG 2011
- Manuscript Received: 12 SEP 2010
- Toyota Motor Corporation, Japan
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