Microstructure and thermal residual stress analysis of SiC fiber through Raman spectroscopy
Article first published online: 15 AUG 2013
Copyright © 2013 John Wiley & Sons, Ltd.
Journal of Raman Spectroscopy
Volume 44, Issue 9, pages 1306–1311, September 2013
How to Cite
Xiao, Z., Yang, Y., Jin, N., Liu, S., Luo, X. and Huang, B. (2013), Microstructure and thermal residual stress analysis of SiC fiber through Raman spectroscopy. J. Raman Spectrosc., 44: 1306–1311. doi: 10.1002/jrs.4356
- Issue published online: 3 SEP 2013
- Article first published online: 15 AUG 2013
- Manuscript Accepted: 22 JUN 2013
- Manuscript Revised: 20 JUN 2013
- Manuscript Received: 25 FEB 2013
- Natural Science Foundation of China. Grant Numbers: 51071122, 51271147, 51201135
- State Key Laboratory of Solidification Processing in NWPU. Grant Number: SKLSP201107
- Northwestern Polytechnical University. Grant Number: JC201110
Supporting information may be found in the online version of this article.
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|Table S1 JRS-13-0066-R1.doc||TIFF image||31K||Supporting Information|
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