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Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method

Authors

  • D.H. Kuo,

    Corresponding author
    1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
    • D.H. Kuo, Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan

      G.S. Liou, Institute of Polymer Science and Engineering, National Taiwan University, Taipei 10617, Taiwan

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  • C.Y. Lin,

    1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
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  • Y.C. Jhou,

    1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
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  • J.Y. Cheng,

    1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
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  • G.S. Liou

    Corresponding author
    1. Institute of Polymer Science and Engineering, National Taiwan University, Taipei 10617, Taiwan
    • D.H. Kuo, Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan

      G.S. Liou, Institute of Polymer Science and Engineering, National Taiwan University, Taipei 10617, Taiwan

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Abstract

Organosoluble polyimide (PI)/ceramic composite films with different BN or (BN + AlN) contents were under investigation for their thermal conductive performances. The chosen polyimide constituted by 4,4′-oxydiphthalic dianhydride/2,2-bis(3-amino-4-hydroxyphenyl)hexafluor opropane could be dissolved and cast into thin films at room temperature. The commercially available BN and AlN fillers up to a volume ratio of 0.6 were added to the polyimide and their thermal conductive performances were measured. BN powders needed a surface precoating treatment to avoid sedimentation. The dense and flexible PI/BN composite films, after a drying treatment at 200°C, showed high thermal conductivity of 2.3 W/m·K−1 at a BN volume ratio of 0.6, as compared with 0.13 W/m·K−1 for pristine polyimide. However, in the case of PI/(BN + AlN) composite films, thermal conductive performance degraded because the films became highly porous at the higher AlN content. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers

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